Micron Technology, Inc.
Boise, ID, United States
Req. ID: 145219
MICRON TECHNOLOGY'S VISION IS TO TRANSFORM HOW THE WORLD USES INFORMATION TO ENRICH LIFE AND OUR COMMITMENT TO PEOPLE, INNOVATION, TENACITY, COLLABORATION, AND CUSTOMER FOCUS ALLOWS US TO FULFILL OUR MISSION TO BE A GLOBAL LEADER IN MEMORY AND STORAGE SOLUTIONS. THIS MEANS CONDUCTING BUSINESS WITH INTEGRITY, ACCOUNTABILITY, AND PROFESSIONALISM WHILE SUPPORTING OUR GLOBAL COMMUNITY.
The Micron 3DXP Process R&D group is responsible for developing state of the art high density 3DXP memory technologies. As an engineer within this organization you will be chartered with defining and maintaining physical design rules for current and future 3DXP technologies.
Responsibilities include, but are not limited to:
* Define full design rule (DR) documents to support technology development from conception to full production ramp *Interact with design, product engineering, process & manufacturing to keep abreast of all technology developments to insure DR's are accurate *Support design rule checking (DRC) of both base and mask layers and interface with design teams on decisions concerning DRC waivers *Define algorithms for generation of mask data from drawn base layer data *Drive projects across multi-disciplinary teams focusing on layout and mask generation issues *Drive diagnostic projects across multi-disciplinary teams to understand product and test structure failures and their interaction with layout and mask generated data
* Solid understanding of semiconductor device physics and silicon processing sub 0.1um *Thorough knowledge of the scaling issues of flash memory (and ideally other semiconductor based non-volatile memory technologies) from both a device and product perspective *Excellent understanding of design rules and the device physics and processing issues that control them *Intimate comprehension of the interaction of base & mask layer and the ability to define the mask layer generation from the base layers *Ability to handle multiple complex projects/issues at the same time and deliver results in a timely and orderly manner *Project management skill to drive different teams to interact and solve complex problems in a timely manner
*BS, MS or PhD in EE, Physics, Computer Science, Material Science or Chemistry. *At least 5 years in the semiconductor industry
As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry's broadest portfolio. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint(tm) memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.
Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-SC2 || Tier 4 ||
Micron Technology, Inc.
Website : http://www.micron.com/